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Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A robust scheme of moiré interferometry for real-time observation is employed to study the temperature dependent thermo-mechanical behavior of a ceramic ball grid array package assembly. The ...
Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ...
On Moisture Diffusion Modeling Using Thermal-Moisture Analogy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) ...
Study of Residual Stress Distribution by a Combined Method of Moiré Interferometry and Incremental Hole Drilling, Part I: Theory
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A new method combining Moiré interferometry and the incremental hole-drilling method is developed to determine both uniform and nonuniform residual stress distribution in depth. The study is ...
Study of Residual Stress Distribution by a Combined Method of Moiré Interferometry and Incremental Hole Drilling, Part II: Implementation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experiment is devised to implement the combined method of moiré interferometry and incremental hole drilling which was proposed in the companion paper. A unique experimental apparatus is ...
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ...